DesignCon 2015 will be taking place on the 27-30th January 2015 at the Santa Clara Convention Centre but the call for papers, panels and tutorials closes on the 11th July, so it’s time to get writing.
DesignCon offers a four day conference for the chip, board and design engineering community. With this in mind, DesignCon is asking for submissions in the following categories:
- Optimise Chip-Level Designs for Signal and Power Integrity
- Overcome Analog and Mixed-Signal Modeling and Simulation Challenges
- Wireless and Photonic Integration
- System Co-Design: Chip/Package/Board: Modeling and Simulation
- Characterise PCB Materials and Processing Characterisation
- Apply PCB Design Tools
- Design Parallel and Memory Interfaces
- Optimize High-Speed Serial Design
- Detect and Mitigate Jitter, Crosstalk, and Noise
- Leverage High-Speed Signal Processing for Equalization and Coding
- Ensure Power Integrity in Power Distribution Networks
- Achieve Electromagnetic Compatibility and Mitigate Interference
- Apply Test and Measurement Methodology
- Ensure Signal Integrity with RF/Microwave/EM Analysis Techniques
Submit your proposals here.
