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The 3rd annual Electronic Design Innovation Conference (EDI CON) has extended the deadline for submissions until November 30th, 294. The event, which takes place from 14-16th April 2015 in Beijing, covers topics related to all aspects of RF, microwave, EMI/EMC and high speed digital design. Authors are requested to submit a draft paper or comprehensive abstract that provides a high level of detail about the proposed paper.

For more details or to submit your paper/abstract, go to: ediconchina.com/CallforPapers